Bittele Electronics is a premier provider of mixed PCB assembly services, offering a seamless integration of Surface Mount Technology (SMT) and Through-Hole Technology (THT). This specialized assembly technique caters to complex electronic designs requiring a combination of component placement methods for optimal performance and reliability. Bittele’s capabilities extend across industries like automotive, aerospace, consumer electronics, and medical devices, making it a trusted partner for precisely delivering intricate assemblies.

Our comprehensive services cover everything from Design for Assembly (DFA) considerations to automated and manual placement techniques, ensuring each project meets rigorous quality standards. With cutting-edge facilities and a commitment to innovation, Bittele is uniquely positioned to handle the complexities of mixed PCB assembly.

Mixed PCB Assembly is a manufacturing approach that combines Surface Mount Technology (SMT) and Through-Hole Technology (THT) on the same PCB. This method leverages the strengths of both techniques: SMT for high-density and compact components and THT for robust mechanical connections and larger components. Mixed assembly is essential for devices requiring versatility, such as industrial machinery, automotive systems, and advanced consumer electronics.

Mixed PCB assembly offers numerous advantages for modern electronic designs:

1. Enhanced Versatility: Combines the benefits of SMT and THT to support diverse design requirements.
2. Optimized Space Utilization: SMT ensures high-density layouts, while THT accommodates larger components.
3. Improved Durability: THT connections provide mechanical strength, ideal for high-stress applications.
4. Design Flexibility: Enables the integration of complex circuitry within compact devices.
5. Cost Efficiency: Reduces overall production costs by optimizing placement techniques.

Mixed PCB assembly involves a variety of components, including:

• Passive Components: Resistors, capacitors, and inductors for basic circuit functions.
• Active Components: Integrated circuits (ICs), transistors, and diodes for signal processing.
• Connectors and Terminals: Used for interfacing between devices.
• Advanced Packages: BGA, QFN, and leadless chips for high-performance applications.

Automated Placement:

• Ideal for SMT components.
• Ensures high precision and repeatability.
• Reduces production time for large-scale manufacturing.

Manual Placement:

• Used for THT and unique components.
• Allows for careful handling of delicate or irregularly shaped parts.
• Essential for low-volume or prototype assemblies.

By combining automated and manual placement, Bittele achieves unmatched precision and flexibility in mixed PCB assembly.

DFA is a critical aspect of mixed PCB assembly, focusing on optimizing the design for manufacturability and assembly efficiency. Key DFA considerations include:

• Component Placement: Ensuring adequate spacing to avoid soldering issues.
• Thermal Management: Incorporating heat sinks or thermal vias for high-power components.
• Solder Joint Integrity: Designing pads and vias for reliable soldering.
• Inspection Accessibility: Allowing space for automated optical inspection (AOI) and X-ray inspection.

Bittele’s engineering team performs detailed DFA reviews to identify potential issues early and streamline the assembly process.

Bittele Electronics excels in mixed PCB assembly by integrating surface mount (SMT) and through-hole technologies, delivering flexible, reliable, and cost-effective solutions for diverse industries. This approach accommodates compact designs while ensuring the mechanical strength needed for high-power and high-stress applications, such as automotive, medical, and aerospace systems.

• Flexibility & Durability: Mixed assembly supports a wide range of components, offering robust connections for heavy-duty parts and precise placement for high-frequency circuits. This ensures reliability in harsh environments, such as high-vibration or extreme temperatures.
• Optimized Performance: Through-hole components manage high currents efficiently, while SMT minimizes signal interference, enabling compact, high-density layouts that save space and enhance functionality.
• Cost-Effectiveness: Efficient use of materials, tailored processes, and reduced prototyping costs make mixed assembly a budget-friendly choice without compromising quality.
• Quality Assurance: Bittele employs AOI, X-ray inspection, and functional testing to ensure defect-free production, complemented by expert DFA support to streamline manufacturability.
• Turnkey Solutions: From sourcing to assembly and testing, Bittele’s all-in-one service simplifies production, ensures consistent quality, and accelerates time-to-market.

Backed by eco-friendly practices and decades of expertise, Bittele is your trusted partner for reliable and innovative mixed PCB assembly solutions.

Mixed PCB assembly is a cornerstone of modern electronics manufacturing, offering the perfect blend of flexibility, durability, and efficiency. Bittele Electronics stands out as an industry leader, delivering high-quality mixed assemblies tailored to each client's unique needs. From automated placement of SMT components to the careful manual assembly of THT parts, Bittele combines cutting-edge technology with unparalleled expertise to ensure your designs come to life with precision and reliability.

Whether you’re developing a prototype or scaling up for mass production, Bittele’s mixed PCB assembly services provide a robust, cost-effective solution that meets the demands of today’s complex electronics.

• Flex and Rigid-flex PCB Assembly
• PCB Assembly Process
• Low-Cost Kitted PCB Assembly Services
• PCB Assembly
• Prototype PCB Assembly Services